Test probe manipulator for wafer-probing apparatus
作者： Hans Schmidt , Helmut Gunter
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摘要: The test-probe manipulator for a test probe use with semiconductor wafers utilizes three adjusting spindles (50,51,52) arranged on the same side of manipulator. occupies little space and is easy to operate. All axes translational freedom perform linear motions independent each other. Accuracy adjustment improved as compared conventional devices. Easy placement removal from platform are ensured.
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