作者: Ming-I Wang , Li-Hsun Ho , Hui-Min Wu , Wei-Cheng Wu , Chien-Hsin Huang
DOI:
关键词: Layer (electronics) 、 Structural engineering 、 Microelectromechanical systems 、 Substrate (printing) 、 Manufacturing process 、 Optoelectronics 、 Engineering
摘要: A MEMS device includes a vent hole structure and disposed on same side of substrate. The adjoins the with an etch stop therebetween. chamber, metal layer having at least thereon as to connect chamber through structure. Accordingly, has lateral hole. Furthermore, are substrate, manufacturing process is convenient timesaving.