Multilayer microcavity devices and methods

作者: Walter R. Vandaveer , Ingrid Fritsch , Charles Sherman Henry , Nicole Bratcher , Benjamin P. Bowen

DOI:

关键词: PolyimideOptoelectronicsPerpendicularOpticsMaterials scienceElectrodeWaferInsulator (electricity)

摘要: Microcavities and micropores that are microscopic (<1 mm) in width depth contain any number of individually-addressable electrodes, separated by insulators, along the walls each cavity. The conducting materials, insulator materials can be deposited alternately onto a starting substrate, which is typically an oxidized silicon wafer or polyimide film, but may substrate shows good adhesion to layered on it. cavities etched through these layers, perpendicular plane exposing layers at their edges. Pores carved entirely device.

参考文章(50)
Kenichiro Miyahara, Package for semiconductor device ,(1994)
Claudia Steinem, Karsten Reihs, Hans-Joachim Galla, Solid-supported membrane biosensors ,(1997)
Thomas E. Babinski, John C. Mather, Christopher J. Wieloch, Power substrate with improved thermal characteristics ,(1995)
Naoki Sakurai, Mutsuhiro Mori, Kenichi Onda, Hideki Miyazaki, Akihiko Kanouda, Hidetoshi Arakawa, Semiconductor integrated circuit unit ,(1991)
William P. Kornrumpf, Charles W. Eichelberger, Robert J. Wojnarowski, Flexible high density interconnect structure and flexibly interconnected system ,(1992)
Kiyokazu Moriizumi, Naomi Fukunaga, Shunichi Kikuchi, Multilayer thin-film wiring board ,(1995)