Semiconductor memory device and method of fabricating the same

作者: Fumitaka Arai , Riichiro Shirota , Makoto Mizukami

DOI:

关键词: Stack (abstract data type)Gate oxideConductivityGate dielectricElectrical engineeringSemiconductor memoryLayer (electronics)Materials scienceSemiconductorMetal gateOptoelectronics

摘要: A semiconductor memory device includes: a substrate, on which an impurity diffusion layer is formed in cell array area; gate wiring stack body the area, multiple wirings are stacked and separated from each other with insulating films; film side surface of body, charge storage contained; pillar-shaped layers arranged along one surfaces opposed to via film, having same conductivity type as layer; data lines be contact upper intersect wirings.

参考文章(20)
Edward J. Nowak, Wilfried E. Haensch, Hybrid-orientation technology buried n-well design ,(2005)
Shigeyuki Takagi, Shigeru Kinoshita, Makoto Mizukami, Semiconductor memory and method for manufacturing a semiconductor memory ,(2007)
Kikuko Sugimae, Makoto Sakuma, Yasuhiko Matsunaga, Fumitaka Arai, Semiconductor device with double barrier film ,(2004)
Naoki Kusunoki, Fumitaka Arai, Nobutoshi Aoki, Hiroyoshi Tanimoto, Riichiro Shirota, Toshiyuki Enda, Non-volatile semiconductor memory and method for controlling a non-volatile semiconductor memory ,(2007)
Takuji Tanigami, Hiroshi Sakuraba, Fumiyoshi Matsuoka, Ryusuke Matsuyama, Shinji Horii, Syounosuke Ueno, Fujio Masuoka, Memory cell unit, nonvolatile semiconductor storage device including memory cell unit, and memory cell array driving method ,(2004)