Mechanical lift-off process of a metal layer on a polymer
作者： Andre Schiltz , Jean Palleau , Joaquim Torres
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摘要: A lift-off process for removing a portion of metal layer (4). The is formed on dielectric polymer substrate with interposition corresponding an intermediate (2). This comprises the steps selecting material so that its interface has low adhesivity; applying to structure mechanical stress causing detachment at interface; and chemically layer.
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