Fabrication of self-aligned via holes in polymer thin films

摘要: A low-cost and efficient process produces self-aligned vias in dielectric polymer films that provides electrical connection between a top conductor bottom conductor. The is achieved by printing conductive posts on the first patterned layer, followed deposition of an unpatterned layer dielectric, second layer. are formed during flash annealing post after deposited, but before deposited. In this process, material annealed with light, resulting release energy which removes post.