作者: D.Y. Sim , T. Kurabayashi , M. Esashi
DOI: 10.1109/SENSOR.1995.721800
关键词:
摘要: A new bakable silicon pneumatic microvalve has been developed for advanced semiconductor fabrication processes. Two micromachined glass-silicon structures were bonded together by Au-Si eutectic bonding. This was further to Kovar block which is welded to, stainless steel tubes. The gas flow rate could be controlled from 0.1 sccm 35 at 25 - 120/spl deg/C