Method for vapor deposition

作者: Roger Hamamjy , Andreas Hegedus , Gregg Higashi , Khurshed Sorabji , Gang He

DOI:

关键词:

摘要: Embodiments of the invention generally relate to methods for chemical vapor deposition (CVD) processes. In one embodiment, a method processing wafer within reactor is provided which includes heating at least disposed on carrier by exposing lower surface radiation emitted from lamp assembly and flowing liquid through passageway extending throughout maintain lid predetermined temperature, such as range about 275° C. 325° The further traversing along track chamber containing showerhead an isolator another exhaust assembly, removing gases assembly.

参考文章(29)
Jeong-Ho Lee, Dae-Youn Kim, Yong-Min Yoo, Multiple inlet atomic layer deposition reactor ,(2006)
Roger Hamamjy, Andreas G. Hegedus, Gregg Higashi, Khurshed Sorabji, Gang He, Wafer carrier track ,(2010)
Robert Jeffrey Bailey, John Timothy Boland, Lawrence Duane Bartholomew, Robert Arthur Ewald, Wafer processing reactor having a gas flow control system and method ,(2000)
Jose F. Casillas, James P. Garcia, Daniel M. Dobkin, Wilbur C. Krusell, Frederick F. Walker, Chemical vapor deposition of silicon dioxide using hexamethyldisilazane ,(1993)
Rhett B. Jucha, Randall C. Hildenbrand, Cecil J. Davis, Robert T. Matthews, Rudy L. York, Joseph D. Luttmer, Lee M. Loewenstein, Wafer processing apparatus having independently controllable energy sources ,(1988)
William J. Durbin, Richard H. Matthiesen, Dennis C. Fenske, Ron van Os, Eric D. Ross, A plasma enhanced chemical processing reactor and method ,(1996)
Roger Hamamjy, Harry Atwater, Andreas Hegedus, Gang He, Melissa Archer, Stewart Sonnenfeldt, Khurshed Sorabji, Gregg Higashi, Methods and apparatus for a chemical vapor deposition reactor ,(2009)