作者: Hideo Iwasaki , Shin-ya Yokoyama , Tomoharu Tsukui , Mikio Koyano , Hidenobu Hori
DOI: 10.1143/JJAP.42.3707
关键词:
摘要: The equipment for the evaluation of figure merit ZT has been fabricated and values have estimated thermoelectric devices modules which were simultaneously prepared using same materials. It is pointed out that loss from an electrode a solder as binder between p- n-type cannot be neglected in module easily quantitatively by Harman method. approximately 7% present possible improvement proposed.