Conductor structure and method
作者： Yi-Hsuan Hsiao , Chih-Ping Chen , Yen-Hao Shih
DOI:
关键词:
摘要: A method of forming an interlayer conductor structure. The includes a stack semiconductor pads coupled to respective active layers for circuit. include outside perimeters each having one side layer. Impurities are implanted along the form lower resistance regions on pads. Openings then formed in expose landing area conductors corresponding pad and define inside perimeter at least Inside by implanting impurities contacts configured overlap be continuous with region.
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