Interfacial reaction and microstructure study of DSS/Cu/Ti64 diffusion-welded couple
作者： Sukumar Kundu , Asmita Chakraborty , Brajendra Mishra
DOI: 10.1007/S40194-017-0525-Y
关键词:
摘要: In the present study, interfacial reaction and microstructure behavior of diffusion-welded joints (DWJs) between duplex stainless steel (DSS) Ti–6Al–4V alloy (Ti64) with copper interlayer were investigated. The carried out at 825, 850, 875 900 °C temperature for 60 min under 4 MPa uniaxial pressure in vacuum. Welded joint was characterized by light microscopy scanning electron using backscattered mode. Layer-wise Cu4Ti, Cu2Ti, Cu4Ti3, CuTi CuTi2 intermetallic phases formed Cu–Ti64 interface width layers increases increase welding temperature. However, DSS–Cu completely free from intermetallics. activation energy calculated interface. values showed that grew faster than other Cu–Ti-based reaction. phase first nucleates intermetallics due to its lowest energy. highest tensile strength ~ 516 (~ 79% DSS) along 6.6% ductility achieved processing
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