作者: D. M. Tennant
DOI: 10.1007/978-1-4612-0531-9_4
关键词: Materials science 、 Lithography 、 Integrated circuit 、 Electron-beam lithography 、 Optoelectronics 、 Resist 、 Semiconductor device fabrication 、 Electronic packaging 、 Computational lithography 、 Next-generation lithography
摘要: … These enhancements include: optical proximity correction, and phase-shifting masks, as well as non-mask related changes such as innovative off-axis illumination designs in order to …