Pattern-sensitive deposition for damascene processing
作者： Charles H. Recchia , Angelo W. Kandas , Alan M. Myers , Sam Sivakumar , Makarem A. Hussein
DOI:
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摘要: A method of forming an interconnection including the steps a sacrificial material that comprises physical property is generally insensitive to photo-reaction in via through dielectric masking over conductive material. The also includes trench and removing from via.
lens.org 参考文章(12)
Thomas Zettler, Ulrich Scheler, Method for producing a metallization level having contacts and interconnects connecting the contacts ,(1993)
Chien Chiang, David B. Fraser, Method for forming multileves interconnections for semiconductor fabrication ,(1996)
James K. Kai, Bhanwar Singh, Fei Wang, Dual damascene process using sacrificial spin-on materials ,(2000)
Chuanbin Pan, Chien Chiang, Silicon-rich block copolymers to achieve unbalanced vias ,(1997)
Subhash Gupta, Rich Klein, Ming-Ren Lin, Steven Avanzino, Scott D. Luning, Dual damascene with a sacrificial via fill ,(1995)
Samuel Broydo, Mehul Naik, Method of producing an interconnect structure for an integrated circuit ,(1999)
A.J.G. Strandjord, P.E. Garrou, R.H. Heistand, T.G. Tessier, MCM-LD: large area processing using photosensitive-BCB electronic components and technology conference. ,vol. 18, pp. 269- 276 ,(1995) , 10.1109/96.386260
Min Yu, Method for etching low k dielectric layers ,(1999)
Jung-Hsien Hsu, Chung-Kuang Lee, Pin-Nan Tseng, Method for making metal contacts and interconnections concurrently on semiconductor integrated circuits ,(1996)
Jen-Shiang Leu, Jeng-Shiuan Shih, Method of preventing photoresist residue on metal lines ,(1997)