Atomic layer deposition of high-/spl kappa/ dielectric for germanium MOS applications - substrate

作者: C.O. Chui , H. Kim , P.C. McIntyre , K.C. Saraswat

DOI: 10.1109/LED.2004.827285

关键词: OptoelectronicsAtomic layer depositionGate dielectricMetal gateGermaniumCapacitorKappaDielectricLeakage (electronics)Materials scienceElectronic engineering

摘要: In this letter, we present the use of atomic layer deposition (ALD) for high-/spl kappa/ gate dielectric formation in Ge MOS devices. Different surface cleaning methods prior to ALD have been evaluated together with effects on inserting a oxynitride (GeO/sub x/N/sub y/) interlayer between and substrate. By incorporating thin GeO/sub y/ interlayer, demonstrated excellent capacitors very small capacitance-voltage hysteresis low leakage. Physical characterization has also done further investigate quality interlayer.

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