Microelectromechanical system device and method for preparing the same for subsequent processing
作者： Paul Felice Reboa , Chien-Hua Chen , Charles C. Haluzak
DOI:
关键词: Microelectromechanical systems 、 Sputtering 、 Nanotechnology 、 Materials science
摘要: A method for preparing a microelectomechanical system (MEMS) device subsequent processing is disclosed. The includes establishing an anti-stiction material on exposed surfaces of the MEMS device. include at least interior surface chamber and external selectively removed from portion via plasma sputtering process under controlled conditions.
lens.org 参考文章(15)
David Jackson, Precision surface treatments using dense fluids and a plasma ,(2003)
Stephen P. DeOrnellas, Leslie G. Jerde, Steven Marks, Cobalt silicide etch process and apparatus ,(2000)
Charles C Haluzak, Arthur Piehl, Chien-Hua Chen, Jennifer Shih, System and method for direct-bonding of substrates ,(2005)
Michael Mignardi, Simon Jacobs, Toshiyuki Kaeriyama, Richard Knipe, Micromechanical device recoat methods ,(2001)
Matthew G. Hankins, David R. Wheeler, Thomas M. Mayer, Anti-stiction coating for microelectromechanical devices ,(2002)
Aaron Partridge, Markus Lutz, Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems ,(2005)
Kenneth A. Peterson, William R. Conley, Protection of microelectronic devices during packaging ,(2000)
Andrew G. Huibers, Satyadev R. Patel, Steven S. Chiang, Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates ,(2005)
Y.B Ning, A.W Mitchell, R.N Tait, Fabrication of a silicon micromachined capacitive microphone using a dry-etch process Sensors and Actuators A-physical. ,vol. 53, pp. 237- 242 ,(1996) , 10.1016/0924-4247(96)01130-2
Igor Gory, Fadziso Mantiziba, Bruce Gnade, Stiction resistant release process ,(2003)