作者: Bin-Shing Chen
DOI:
关键词: Reactive-ion etching 、 Oxide 、 Structural engineering 、 Trench 、 Materials science 、 Planar 、 Substrate (electronics) 、 Optoelectronics 、 Layer (electronics) 、 Wafer 、 Integrated circuit
摘要: A technique for forming an integrated circuit device having a self-aligned gate layer. The method includes variety of steps such as providing substrate, which is commonly silicon wafer. Field isolation regions including first region and second are defined in the semiconductor substrate. recessed between trench regions. made using reactive ion etching technique. thickness material polysilicon deposited overlying or on region, active region. step selectively removing portions performed, where forms substantially planar into step.